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網(wǎng)校開發(fā)及擁有的課件范圍涉及公務(wù)員、財(cái)會(huì)類、外語(yǔ)類、外貿(mào)類、學(xué)歷類、

職業(yè)資格類、計(jì)算機(jī)類、建筑工程類、等9大類考試的在線網(wǎng)絡(luò)培訓(xùn)輔導(dǎo)。

時(shí)間：10月10日（星期五）上午10：30

地點(diǎn)：安徽理工大學(xué)大學(xué)生創(chuàng)業(yè)基地

需求專業(yè)：電子科學(xué)與技術(shù)、電子信息工程、微電子、機(jī)械電子、通信、自動(dòng)化、儀器與測(cè)量、生物醫(yī)學(xué)工程等相關(guān)專業(yè)

泰瑞達(dá)（上海）有限公司招聘簡(jiǎn)章

About Teradyne

Teradyne (NYSE:TER) is the world's largest supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. Teradyne provide test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as cells in system-on-a-chip (SOC) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and Internet applications. We deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. Teradyne was founded at Boston in 1960. With the development of global testing business, we established the Teradyne Shanghai Co. Ltd. in China in 2001. And we also have an extension office of Application Development Center in Hefei in 2007 in order to satisfy the ever growing business demand. In 2013, Teradyne had sales of $1.43 billion and currently employs about 3,800 people worldwide.

泰瑞達(dá)公司

泰瑞達(dá)(美國(guó)紐約證券交易所上市企業(yè))是全球最大的集成電路自動(dòng)測(cè)試設(shè)備供應(yīng)商。產(chǎn)品主要是用于半導(dǎo)體、板卡及電子系統(tǒng)的測(cè)試平臺(tái)。泰瑞達(dá)為包括處理器、微控制器、消費(fèi)類電子產(chǎn)品、汽車電子、存儲(chǔ)器、混合訊號(hào)IC、片上系統(tǒng)、射頻身份識(shí)別IC及通信系統(tǒng)在內(nèi)的電子產(chǎn)品提供優(yōu)質(zhì)高效的測(cè)試方案。泰瑞達(dá)的客戶均為全球頂尖的半導(dǎo)體、電子、自動(dòng)化及通訊設(shè)備廠商。在半導(dǎo)體測(cè)試設(shè)備供應(yīng)商中，泰瑞達(dá)是唯一能覆蓋模擬,混合信號(hào),存儲(chǔ)器及VLSI器件等所有領(lǐng)域的。泰瑞達(dá)成立于1960年，總部設(shè)于美國(guó)馬薩諸塞州首府波士頓。隨著全球測(cè)試業(yè)務(wù)的發(fā)展，泰瑞達(dá)2001年在上海成立中國(guó)總公司，于2007在合肥設(shè)立了應(yīng)用開發(fā)部門的分支機(jī)構(gòu)以滿足日益增長(zhǎng)的業(yè)務(wù)需求。2013年，泰瑞達(dá)全球銷售總額達(dá)14億美元。目前，全球員工約3800名。

For more information, please visit company’s websitehttp://www.teradyne.com.

Job Title: Applications Engineer (應(yīng)用開發(fā)工程師)

Organization: Center Engineering Organization, China Application Development Center (ADC)

Work Location: Hefei (合肥)

Job Description

Develop highly sophisticated SOC test solutions（circuit design, signal processing, programming, debug,…similar to Embedded System Design）for world-wide customers

Provide innovative engineering solutions to conquer unique challenges

Fly overseas to personally install your solution on-site

Collaborate with overseas experts on a daily basis

Requirements

Bachelors or Master’s degree in Electronic Engineering or similar areas

Knowledge of Digital Signal Processing is desirable

Experience in analysis and debug of digital/analog circuits

Unix/C/C++ or Windows/VB programming experience

Excellent interpersonal and teamwork skills.

Experienced in problem solving

Excellent spoken and written English communication skills

Automatic Testing Equipment experience will be a plus.

Job Title: Software Engineer (軟件工程師)

Organization: Center Engineering Organization, China Application Development Center (ADC)

Work Location: Hefei (合肥)

Job Description

Unix/Linux Operating System programming

Design plugin for Automatic Test Equipment with C, C++ or .NET platform

Develop platform to platform converters with perl, C# or VB.net

Responsible for the full cycle of software development – investigation tasks, initial design, development, bug fixing, quality engineering, documentation, and maintenance

Requirements

Bachelor degree in Computer Science or Software Engineering. Master degree is desirable.

Must possess a strong understanding of Compiling Fundamental and Object-Oriented Programming.

Must possess a minimum of 1+ years experience in software development.

Must possess a good understanding of Software Engineering theories and methodologies.

Familiar with Microsoft .Net Platform.

Familiar with C#, C++, C, VB, Python, Perl and other programming language.

Familiar with Microsoft Windows, Sun Solaris Unix and Linux system.

ATE experience will be a plus.

Good command of spoken and written English.

Strong self-motivation and good communication skills.

Job Title: Hardware Design Engineer (硬件研發(fā)工程師)

Organization: Global Hardware Business Unit, China Hardware Design Center (HDC)

Work Location: Hefei (合肥)

Role Summary/Purpose

Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology, work here can be challenging and exciting.

Job Description

Design semiconductor test hardware solutions of next generation semiconductor devices for world-wide customers

Provide global hardware design support and consulting

Give global hardware infrastructure support and consulting

Deliver hardware design training and seminars to customers

Do hardware project management

Keep close communication with worldwide Teradyne teams and customers

Requirements

Master’s or Bachelor's degree in Electronic Engineering, Micro-Electronics, Mechatronics, Communication Engineering, Automation, Instrumentation and Measurement, Biomedical engineering or similar major related to circuit design or hardware engineering

Good knowledge and understanding of electronic circuit theory and application

Experience in one or more EDA tools, such as Cadence, OrCAD, Protel, PADS or Mentor Graphics

Knowledge and experience in multi-layer board design

Knowledge and experience in embedded system design

Good communication skills, good written and oral English

Ability to effectively solve problems, open minded

Ability to successfully work in a team, cross-functional environment

Ability to travel oversea for extended period of time

Knowledge/Experience in the following areas is a plus

High-speed design and RF circuitry design

Simulation tools and application, such as Siwave, HFSS, Sigrity

FPGA design and programming/debugging(VHDL, Verilog)

Mechanical design, familiar with one or more CAD tool, like Solid works, AutoCAD

One or more programming/script language(C, VB, Perl, Python)

Signal integrity(SI) theory and application

Design For Manufacturing(DFM)

German, Japanese or Korean language skill

歡迎電子科學(xué)與技術(shù)、電子信息工程、微電子、機(jī)械電子、通信、自動(dòng)化、儀器與測(cè)量、生物醫(yī)學(xué)工程等相關(guān)專業(yè)同學(xué)投遞簡(jiǎn)歷，請(qǐng)關(guān)注院校宣講會(huì)信息現(xiàn)場(chǎng)投遞簡(jiǎn)歷或?qū)⒑?jiǎn)歷投遞至：hr.recruiting.shanghai@teradyne.com

備注：投遞簡(jiǎn)歷時(shí)，請(qǐng)?jiān)卩]件的主題里注明：畢業(yè)學(xué)校+應(yīng)聘職位“硬件研發(fā)工程師” 或“應(yīng)用開發(fā)工程師”或“軟件工程師”。

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